Hardware1 hOctober 9, 2026, 10:18

Analyst: Nvidia May Use Intel Foveros Packaging in H2 2028

GF Securities analyst Jeff Pu says Nvidia could adopt Intel's Foveros chip packaging for its AI products in the second half of 2028, when Intel's 14A process enters production. The move would ease pressure on TSMC's strained packaging capacity.

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Analyst: Nvidia May Use Intel Foveros Packaging in H2 2028

Nvidia may use Intel Foveros packaging for AI chips in H2 2028
Intel's 14A process is slated to enter production in H2 2028
Foveros is a true 3D stacking tech placing tiles atop a base die
Google was earlier tipped to use Intel EMIB-T packaging for TPU chips

#Nvidia#Intel#TSMC#Foveros

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