Intel, TSMC, Samsung converge on backside power as packaging becomes next battleground

According to DIGITIMES, Intel, TSMC and Samsung are converging on backside power delivery, with packaging emerging as the next competitive divide. Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027.

• AI accelerator package power rose from ~500W (A100) to 3,500–4,000W (Rubin Ultra, 2027)
• Intel, TSMC and Samsung converge on backside power delivery
• Packaging becomes the next competitive divide
• TSMC locked in 3–6% wafer price hikes for 2027