Four glass makers converge on 510x515mm substrate format

Corning, AGC, Nippon Electric Glass and Schott have aligned their next-generation glass substrate and through-glass via (TGV) roadmaps on a unified 510×515mm format. The move hints at TSMC's next step in packaging larger AI chips.

• Corning, AGC, NEG and Schott adopt a unified 510×515mm format
• The format covers glass substrates and through-glass vias (TGV)
• Shift is driven by growing AI chip sizes and packaging needs
• Industry awaits TSMC's next move in this area