Applied Materials and Intel expand AI chip collaboration

Applied Materials and Intel are deepening their EPIC Center collaboration on next-generation transistors, interconnects and advanced packaging. The effort targets AI chip manufacturing bottlenecks, including interconnect scaling and Intel's Foveros 3D packaging.

• Partnership covers transistors, interconnects and advanced packaging
• Intel brings its Foveros 3D packaging technology
• Goal is to ease AI chip manufacturing bottlenecks