Applied Materials and Intel Partner on AI Chipmaking at EPIC Center

Applied Materials said on October 6, 2026 that it is working with Intel to speed up development of chipmaking technologies for next-generation transistors, interconnects and advanced packaging. The collaboration links Applied's EPIC Center in Silicon Valley with Intel's Hillsboro, Oregon campus and covers Foveros-based 3D stacking.

• The collaboration spans advanced logic nodes, interconnect scaling and packaging for AI workloads
• Work includes Foveros-based 3D stacking with higher density and better thermal performance
• The EPIC Center has over 180,000 square feet of cleanroom and is set to be ready in 2026
• Applied plans up to $4 billion in investment over seven years and 2,000 engineering jobs