Onsemi Unveils Platform That Turns Silicon Wafers Into Power Packages

Onsemi announced the EPP platform, which embeds heterogeneous Si, SiC, and GaN dies directly into 12-inch silicon wafers with precision RDL. The technology replaces wire bonds and molding compounds, enabling up to 5x power density.

• EPP platform embeds Si, SiC, and GaN dies into 12-inch wafers
• Precision RDL replaces wire bonds and molding compounds
• Up to 5x power density claimed