Snapdragon 8 Elite Gen 6 Gets Offset PoP Design for Better Thermals

Qualcomm has introduced an offset Package-on-Package design in the Snapdragon 8 Elite Gen 6 and Extreme Gen 6 that shifts the CPU and GPU away from primary heat-generating areas. Unlike Apple's A20 Pro, which moves memory to the side of the SoC, Qualcomm keeps memory on top but repositions the compute blocks. Memory configuration remains an OEM choice.

• Offset PoP layout moves CPU and GPU away from main heat sources
• Apple's A20 Pro in iPhone 18 Pro moves memory to the side of the SoC
• Memory config (12 or 16GB) stays an OEM choice, as on Galaxy S26 Ultra
• Previous Snapdragon 8 Elite chips ran warmer than MediaTek and Apple