Semtech backs XPO with 200G/lane optical ICs
Semtech has joined the XPO Multi-Source Agreement, bringing 200G/lane modulator driver and TIA ICs to the emerging optical interconnect standard for AI infrastructure. The XPO spec targets 12.8 Tbit/s per module with liquid cooling and a roadmap to 400G/lane. Demos run at ECOC 2026 in Málaga on Sept. 21–23.
- XPO MSA targets 12.8 Tbit/s per module at 200G/lane
- Semtech offers quad and octal TIAs plus MZM drivers
- Channel pitches range from 375µm to 750µm
- Datacom optics market to grow from $9B in 2024 to $37B in 2026
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