Kinsus Tech names three challenges for larger AI chip packages

Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, said at the 2026 TPCA Show that surging AI computing demand is pushing advanced packaging toward larger form factors, and identified three challenges for the shift. The company outlined the obstacles at the Taipei event.

• Kinsus flagged three challenges for larger AI chip packages
• AI computing demand is driving bigger packaging form factors
• Remarks came from the R&D VP at the 2026 TPCA Show