Kinsus explores AlN ceramics as glass alternative for AI packaging substrates

Kinsus Interconnect Technology is evaluating aluminum nitride (AlN) ceramics as a core substrate material for large-scale advanced packaging. The company is looking for an alternative to glass, which still faces brittleness and reliability issues.

• Kinsus is studying AlN ceramics for advanced packaging substrates
• Glass remains hampered by brittleness and reliability problems
• Focus is on substrates for large-scale AI packaging