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HardwareOctober 23, 2026, 14:17

HiSilicon backs NearLink SLE 3.0 evolution blue paper at CEIC 2026

At CEIC 2026 in Shenzhen, the International SparkLink Alliance released a NearLink SLE 3.0 Technical Standard Evolution Blue Paper drafted with over 60 standards bodies, chip firms and universities. It charts the path from SLE 1.0's Polar coding and sub-millisecond latency through 2.0's precision positioning to 3.0's faster, denser links; it is a roadmap, not a finished standard.

HiSilicon backs NearLink SLE 3.0 evolution blue paper at CEIC 2026
#HiSilicon#NearLink#OpenHarmony
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