PCIe 8.0 Over UCIe 3.0: Bringing A Proven Protocol Into The Chiplet Era

A technical paper details running PCIe 8.0 over UCIe 3.0 die-to-die interconnects. UCIe standardizes in-package communication and lets PCIe traffic cross chiplet boundaries with seamless interoperability, delivering high bandwidth and better transport efficiency for AI, HPC and heterogeneous compute.

• UCIe 3.0 standardizes die-to-die communication within a package
• PCIe 8.0 gains seamless interoperability across chiplet boundaries
• The approach boosts transport efficiency for AI and HPC
• Conventional board-oriented PCIe implementations are not ideal for in-package links