xFusion: three physical walls hit AI datacenters at once

At OCP Global Summit, xFusion detailed how rack power rising from 20 kW in 2023 to 240 kW in 2026 and chips from 350 W to 2,000+ W simultaneously strain cooling, power delivery and interconnect. It proposes diamond-copper cold plates with 650 W/m·K conductivity and over 4,000 W per-chip cooling.

• Rack power grew from 20 kW in 2023 to 240 kW in 2026; chips from 350 W to 2,000+ W
• Heat flux reached 120 W/cm², with the next generation above 200 W/cm²
• Diamond-copper cold plates: 650 W/m·K and over 400 W/cm² at hot spots
• At 54 V a 1 MW rack draws 18,519 A, with busbar losses above 50 kW