CXMT targets 4F² server DRAM with hybrid bonding by end-2026

Chinese DRAM maker CXMT told shareholders it plans to enter the "uncharted territory" of extreme memory scaling with 4F² server DRAM using hybrid bonding by the end of 2026. The company aims to overcome technical barriers through process innovation rather than conventional scaling.

• CXMT is targeting 4F² density for server DRAM
• Hybrid bonding is planned for end-2026
• The company bets on process innovation over classic scaling