AI substrate bottleneck shifts from design to manufacturing

AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and grow beyond 120x120mm within three to five years. The constraint is shifting from chip design to substrate manufacturing capacity.

• AI accelerator substrates to exceed 100x100mm in the near term
• Sizes could reach 120x120mm within three to five years
• Manufacturing, not design, becomes the limiting factor