Hardware2 hOctober 13, 2026, 14:30

AI substrate material shortages ease, but advanced equipment becomes the bottleneck

According to Digitimes, shortages of materials for AI accelerator substrates are easing, but expansion is now constrained by advanced equipment. TSMC keeps 3nm, 2nm and CoWoS capacity tight and has locked in 3–6% wafer price hikes for 2027.

Digitimes

Open source

AI substrate material shortages ease, but advanced equipment becomes the bottleneck

Shortages of AI accelerator substrate materials are easing
Advanced equipment is now the main expansion bottleneck
TSMC locked in 3–6% wafer price hikes for 2027
3nm, 2nm and CoWoS capacity remains tight

#TSMC#MediaTek#Broadcom

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