Intel Shows Dual-Chip Liquid-Cooled OAM Card for Crescent Island GPUs

At OCP 2026 Intel detailed its D-Series Crescent Island GPUs on the Xe3P architecture: up to 32 cores, 350W, 1.3 PFLOPs of FP8 and up to 512 GB of LPDDR5X. The company also showed a dual-GPU OAM module with liquid cooling and the first N3P die shots.

• Reference D270: 160 GB LPDDR5X, partner cards up to 480–512 GB
• Memory bandwidth up to 1.5 TB/s, 256 next-gen XMX units per chip
• OAM module packs two GPUs with a copper block and liquid cooling
• Day-0 support for Meta Muse Spark Open on four 160 GB cards