Big Tech Moves Away from Nvidia: A Chance for Samsung and SK hynix
Microsoft, Google, Amazon and Meta are accelerating in-house AI chip development, expanding HBM demand for Samsung and SK hynix. Microsoft plans to ship over 1 million Maia 300 units next year with 288GB HBM4, while Gartner expects the ASIC market to grow from $67.7 billion to $203.6 billion by 2030.
- Microsoft to ship over 1 million Maia 300 units in 2026 with 288GB HBM4
- Google TPU 8i gets 288GB HBM, up 50% from Ironwood
- Samsung and SK hynix held 39% and 48% of the HBM market last year
- Gartner: ASIC market to grow from $67.7B to $203.6B by 2030
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