Samsung and SK Hynix Show Rival HBM4 Stacks at SEDEX 2026

At Korea's largest SEDEX 2026 show, Samsung unveiled HBM4 built on 1c DRAM with 12 dies at 11.7 Gbps per pin, while SK Hynix showed a 16-high stack on 1b DRAM with 48 GB capacity. The two rivals are betting on different AI workloads: speed versus capacity.

• Samsung: HBM4 on 1c DRAM, 12 dies, 11.7 Gbps per pin, up to 2.8 TB/s
• SK Hynix: HBM4 on 1b DRAM, 16 dies, 48 GB vs Samsung's 36 GB
• SEDEX 2026 drew 300 companies and 888 booths, a record in 28 years
• SK Hynix forecasts AI infrastructure to scale 20-fold by 2030