SK hynix unveils HBM4, SOCAMM2 and eSSD at TSMC OIP conference

SK hynix showcased its next-gen AI memory lineup at TSMC's Open Innovation Platform conference in Santa Clara, including 36GB 12-high HBM4 and 96GB SOCAMM2 for Nvidia's Vera Rubin superchip, plus HBM4E 48GB and server modules up to 256GB. The company won TSMC's Partner of the Year award in 3DFabric-HBM Integration for the second consecutive year.

• SK hynix won TSMC's Partner of the Year award for 3DFabric-HBM Integration for a second year
• Shown 36GB 12-high HBM4 and 96GB SOCAMM2 for Nvidia Vera Rubin
• Lineup also includes HBM4E 48GB 12-high and HBM4 48GB 16-high
• Server offerings include 256GB 3DS RDIMM and first QLC eSSD PS1101 E3.S