Column: 3D memory could redraw chip competition, weaken US sanctions on China

A Digitimes column argues that the shift to 3D memory could reshape competition in the chip industry and blunt US export controls. In October 2022, BIS restricted equipment and components for making 3D NAND with 128 layers or more.

• BIS has restricted 128-layer-plus 3D NAND equipment since October 2022
• 3D memory could weaken the impact of US sanctions on China
• The shift ties into HBM and advanced packaging competition