Huawei: LogicFolding Architecture Exceeded Expectations, 2027 Kirin Meets Targets

Huawei says its LogicFolding packaging architecture has surpassed expectations, with preliminary results for a 2027 Kirin SoC meeting company targets without access to advanced nodes. The architecture integrates over 50 million hybrid bonds and boosts transistor density by 53.5%. Huawei has shipped 100 million Kirin chipsets since 2023.

• LogicFolding boosts transistor density by 53.5%
• Architecture integrates over 50 million hybrid bonds
• 100 million Kirin chipsets shipped since 2023
• Kirin 9050 was the first to use LogicFolding