Kirin 9050 Pro die shots reveal dual dies on SMIC N+3 and N+2 processes
Die shots of Huawei's Kirin 9050 Pro show a compute die on SMIC's N+3 process bonded via LogicFolding to an SRAM die on N+2. Each die measures 120.65 mm², smaller than the Kirin 9030S at 122 mm².
- Both Kirin 9050 Pro dies measure 11.13 x 10.84 mm (120.65 mm²)
- Compute die is built on SMIC N+3, SRAM die on N+2
- Footprint is smaller than Kirin 9030S at 122 mm², potentially higher die yield
- Chip is used only in Pro Max and RS variants of Huawei flagships
Read next
Hardware