The Silicon Heartland Wants To Be America’s Next Chip Powerhouse

The US Midwest is becoming a semiconductor hub with Intel's $28+ billion Ohio fab, SK hynix's $4+ billion HBM packaging plant in Indiana, and Hemlock's $825 million polysilicon expansion. The main challenge is a shortage of skilled workers.

• Intel builds $28+ billion Silicon Heartland fab in Ohio, launch in early 2030s
• SK hynix to invest $4+ billion in HBM packaging in West Lafayette, Indiana
• Hemlock expands polysilicon output for $825 million with CHIPS subsidy up to $325 million
• Key regional problem is shortage of qualified personnel