TSMC at OIP Forum 2026: AI is reshaping chip design

TSMC's 2026 Open Innovation Platform Forum framed AI as the force reshaping semiconductor design. The company argues faster chips require progress across logic, memory, packaging, interconnects, power delivery and design methods, leaning on its partner ecosystem.

• TSMC called AI the main force reshaping semiconductor design
• Faster chips require progress in logic, memory, packaging and power
• The company leans on its Open Innovation Platform partner ecosystem