20 of China's OSATs push into advanced packaging amid EUV curbs

China is expanding its advanced chip packaging base: about 20 local OSAT companies are ramping up capacity as restrictions on advanced process equipment complicate further scaling. Advanced packaging becomes a workaround to boost chip performance without EUV access.

• About 20 Chinese OSAT companies enter advanced packaging
• EUV equipment restrictions slow process node scaling
• Advanced packaging compensates for lack of access to advanced nodes