Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV

The Institute of the Chinese Academy of Sciences (CAS) reported progress in developing a 3nm GAA process on DUV equipment without using EUV. Technical lead of the national 02 Special project Tianchun Ye presented the route at the IC WORLD conference.

• CAS is developing a 3nm GAA process without EUV lithography
• The route is based on DUV equipment instead of EUV lithography
• Project technical lead is Tianchun Ye
• Presented at the IC WORLD conference in China