AMD Samples Space-Grade Versal AI Core XQRVC1902 in Lidless Package

AMD has begun sampling the Versal AI Core XQRVC1902 adaptive SoC to early access customers in an enhanced space-grade lidless package built for missions up to 15 years. The device is being tested to MIL-PRF-38535 Class Y, with flight-qualified units expected in the second half of 2027.

• Lidless package gives the exposed die a more direct heat path
• Pin-compatible with existing VC1902 in the 2,197-ball BGA
• Tested to MIL-PRF-38535 Class Y, the standard's highest reliability level
• Class Y flight-qualified units due in the second half of 2027