A20 Solder Diagram Leak: Base iPhone 18 Gets Inferior Packaging and 5-Core GPU

A leaked solder joint diagram shows the base A20 chip will skip WMCM packaging, use a 5-core GPU instead of 6–7 cores, and halve L2 cache versus the A20 Pro. The A20 die is estimated at 70–80mm² versus 82.8mm² for the A19, built on TSMC's 2nm N2 process.

• A20 lacks WMCM: DRAM sits beside the SoC, not on top
• Base A20 GPU has 5 cores versus 6–7 on the Pro
• L2 cache: 8MB super cores, 4MB efficiency cores, half of Pro
• A20 die estimated at 70–80mm² versus 82.8mm² for A19