Apple A20 Pro drops PoP packaging for WMCM

Apple's A20 Pro chip has moved from traditional package-on-package (PoP) to Wafer-Level Multi-Chip Module (WMCM), placing memory and processor dies side by side to potentially improve packaging yield and thermal performance.

• A20 Pro adopts WMCM instead of classic PoP packaging
• Memory and processor dies are laid out side by side
• Expected gains in packaging yield and thermal performance