Hardware1 hSeptember 30, 2026, 15:55

AI Drives Larger, Denser Chip Packaging, Challenging Equipment Makers

AI is pushing advanced packaging in opposite directions: package sizes are growing while interconnect pitches and defect tolerances keep shrinking. The trend raises new challenges for equipment makers, discussed at A*STAR.

EE Times

Open source

AI Drives Larger, Denser Chip Packaging, Challenging Equipment Makers

Package sizes are growing while interconnect pitches keep shrinking
Defect tolerances tighten due to AI accelerator requirements
Equipment makers face new technological constraints

Beyond 16 layers: HBM stacks test advanced packaging equipment makers

Hardware

Tier IV open-sources self-driving AI chip design to challenge Nvidia

Hardware

Chip equipment makers face waits of up to 40 months for critical parts

Hardware

AI Drives Larger, Denser Chip Packaging, Challenging Equipment Makers

Beyond 16 layers: HBM stacks test advanced packaging equipment makers

Tier IV open-sources self-driving AI chip design to challenge Nvidia

Chip equipment makers face waits of up to 40 months for critical parts

A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors