Biwin Storage to invest $672M in 2.5D packaging and compute-memory integration

Biwin Storage Technology plans to invest CNY4.5 billion (about $672 million) to expand 2.5D packaging and compute-memory integration technologies. The company is betting on advanced packaging for AI chips.

• Investment totals CNY4.5 billion, roughly $672 million
• Funds target 2.5D packaging and compute-memory integration
• Biwin expands its role in the AI chip supply chain