ACM Shanghai ships first 310×310mm panel-level plating tool as backlog jumps 88%

ACM Shanghai has shipped its first panel-level plating tool for 310×310mm panels, aimed at packaging increasingly large AI chips. The company's order backlog grew 88% as panel-level packaging moves toward customer validation and volume production.

• Tool handles 310×310mm panels for AI chip packaging
• ACM Shanghai order backlog grew 88%
• Panel-level packaging moves toward customer validation and volume production