AI pushes Taiwan's semiconductor ecosystem to compete at system level
A panel with executives from TSMC, MediaTek, ASE and Hermes-Epitek discussed how AI is shifting semiconductor competition from process nodes to the system level. Taiwan's division of labor between design, foundries and packaging must adapt to the new demands.
- Panel included TSMC, MediaTek, ASE and Hermes-Epitek executives
- NYCU Vice President Jack Sun moderated the discussion
- AI shifts competition from nanometers to system-level integration
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