Taiwan panel makers pivot to semiconductors amid structural challenges

Entering Q4 2026, Taiwan's panel makers face rising component costs and weakening demand, pushing them toward the semiconductor segment. The shift comes as TSMC's 3nm, 2nm and CoWoS capacity stays tight and wafer prices rise 3-6% for 2027.

• Taiwan panel makers pivot to semiconductors as display demand weakens
• TSMC locks in 3-6% wafer price hikes for 2027
• TSMC 3nm, 2nm and CoWoS capacity remains tight
• Enterprise SSD demand lifts NAND profits at Samsung and SK Hynix