Simmtech boosts SOCAMM investment as BT substrate supply tightens

Simmtech is increasing investment in SOCAMM substrates for memory packaging, while major makers including Samsung Electro-Mechanics focus capex on large, high-layer-count ABF substrates. Capacity expansion for BT substrates used in memory packaging remains limited.

• Simmtech is ramping investment in SOCAMM memory substrates
• Semco and peers prioritize large high-layer ABF substrates
• BT substrate capacity for memory packaging grows slowly