LG Innotek targets 2028 glass substrate supply as it expands beyond smartphones

LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028. The company sees its chip substrate business improving in 2027 as it seeks to reduce reliance on smartphone camera modules.

• Glass substrate supply for chip packaging expected around 2028
• Chip substrate business seen improving in 2027
• Goal is to cut reliance on smartphone camera modules