New Material Conducts 5 Times Less Heat Than Silicone, Up to 10,000 Times Stiffer

Scientists at North Carolina State University developed a non-porous thin-film perovskite with thermal conductivity around 0.04 W/(m·K) at room temperature. The material blocks heat five times better than silicone and is 700–10,000 times stiffer.

• Thermal conductivity ~0.04 W/(m·K) vs 0.2 for silicone
• Stiffness 700–10,000 times higher than silicone
• Benzene rings replaced standard carbon chains in the film
• Material can be printed as a coating on large areas