Microcapsules in data center walls could absorb server heat

Alexium International is offering US data center developers microencapsulated phase change materials (mPCM) that can be mixed into wallboard, plaster and coatings. During a cooling outage the capsules melt and absorb server heat, then re-solidify as the room cools. The technology, originally developed by BASF, came with the December 2025 acquisition of Microtek Laboratories.

• 15mm board with 3 kg/sqm of capsules stores as much heat as about 9cm of concrete
• Capsules tested through 10,000 thermal cycles, roughly 30 years of daily use
• Three melt points offered, including a 26°C grade for data hall envelopes
• The material stores heat rather than removing it, buying time until backup systems start