TSMC May Raise CoWoS Prices by Up to 20% on AI Chip Demand

TSMC is reportedly discussing a price hike of up to 20% for its CoWoS advanced packaging as AI accelerators with HBM stacks strain supply. The company plans to expand capacity to 130,000 wafers per month in 2026 and 200,000 in 2027.

• A CoWoS price increase of up to 20% is under discussion, TSMC has not confirmed
• CoWoS capacity targeted at 130,000 wafers/month in 2026, 200,000 in 2027
• Equipment lead times have stretched from 3–6 to 6–8 months
• A new advanced packaging plant takes about three years to reach full load