Micron drops 4F² DRAM commercialization after 20 years of research
Micron confirmed it will not commercialize 4F² DRAM despite more than two decades of research, citing better economics and competitive density from conventional 6F² designs. The company will focus on advanced 6F² manufacturing and a longer-term move to vertically stacked 3D DRAM, while Samsung, SK Hynix and CXMT continue 4F² development.
- 4F² theoretically cuts cell footprint by about 33%
- Micron says density gains do not offset added cost and complexity
- CXMT targets server DDR5 on 4F² before the end of 2026
- Micron's long-term goal is vertical stacking similar to NAND
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