AUO tailors glass substrates to semiconductor processes, not panel size rivalry

AUO is adapting its glass core substrate specifications to semiconductor process requirements rather than competing with Innolux on panel dimensions, Chairman and CEO Paul Peng said. The focus is on substrates for advanced chip packaging.

• AUO is tuning glass substrate specs for semiconductor processes
• The company is not competing with Innolux on panel size
• Chairman and CEO Paul Peng outlined the approach