Microsoft Maia 300 leads 2nm race at TSMC as Intel EMIB-T struggles
Microsoft is an early adopter of TSMC's 2nm process for its Maia 300 AI chip, while Google's next-gen TPU faces delays. TSMC also struck a $2 billion interposer deal with GlobalFoundries, and Intel's EMIB-T packaging is reportedly facing yield challenges.
- Microsoft Maia 300 is among the first chips on TSMC's 2nm node
- TSMC and GlobalFoundries signed a $2 billion interposer deal
- Google's next-generation TPU is delayed
- Intel's EMIB-T packaging faces yield challenges
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