CXMT targets DDR5 RDIMMs by end of 2026
China's leading DRAM maker CXMT has disclosed progress on its 4F² DRAM architecture and plans to introduce DDR5 RDIMMs by the end of 2026. SiCarrier showcased advanced chipmaking equipment, highlighting China's push in semiconductor manufacturing.
- CXMT is developing 4F² DRAM and plans DDR5 RDIMMs by end of 2026
- SiCarrier showcased advanced chipmaking equipment
- Chinese toolmakers are moving into hybrid bonding for chip packaging
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