Ayar Labs and GUC show co-packaged optics thermal stability at 100 Tbps

Ayar Labs and Global Unichip ran thermal co-simulation of a multi-chip package with TeraPHY optical engines: a 105×140 mm package with two XPUs, 8 HBM4 modules and 8 optical engines delivers over 100 Tbps at a power envelope above 3 kW. An air-cooled heatsink failed the temperature spec, while an impingement cold plate at 4.5 LPM passed.

• 105×140 mm package: 2 XPUs, 8 HBM4 modules, 4 I/O chiplets, 8 TeraPHY optical engines
• Full-duplex optical interface above 100 Tbps from a single XPU package
• Power envelope above 3 kW per package demands liquid cooling
• Air heatsink failed the spec; cold plate at 4.5 LPM passed