Foxconn unveils Vera Rubin AI racks and liquid cooling at OCP Summit
Foxconn showcased rack-scale AI infrastructure at the Open Compute Project Global Summit 2026 in San Jose, California, combining compute platforms, high-speed interconnects, power delivery and liquid cooling. The offering targets data centers running AI workloads.
- Showcased at OCP Global Summit 2026 in San Jose
- Includes Vera Rubin racks and liquid-cooling systems
- Combines interconnects and power delivery
- Targets rack-scale AI infrastructure
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