xMEMS Starts Mass Production of XMC-2400 and XMC-4800 Solid-State Cooling Chips

xMEMS Labs has begun mass production of its XMC-2400 and XMC-4800 µCooling solid-state chips, enabling silent, fanless active cooling for smartphones, smart glasses, and servers. Temperature drops reach up to 25°C with no moving parts, and the first commercial consumer products are expected in early 2027.

• XMC-2400: 7.42×9.48×1.13 mm, up to 28 cm³/s airflow at 1300 Pa, 150 mW draw
• XMC-4800: 9.93×14.35×1.13 mm, up to 48 cm³/s airflow at 1100 Pa, 240 mW draw
• Chip and system temperature drops of 10 to 25°C reported in testing
• First consumer products with XMC-2400 expected in early 2027