FormFactor and Teradyne partner on chip testing, Teradyne invests $300M

FormFactor and Teradyne announced a broad technology collaboration in next-generation semiconductor testing. Teradyne will also make a $300 million strategic equity investment in FormFactor, subject to regulatory approval. The partnership targets testing for HPC, advanced packaging, HBM and silicon photonics.

• Teradyne to invest $300 million in FormFactor common stock
• Collaboration covers testing for HPC, HBM, advanced packaging and photonics
• Deal subject to customary closing conditions and regulatory approvals
• Goal is to speed next-gen chips from development to high-volume production