New film blocks heat and is up to 10,000 times stiffer than silicone

Researchers at North Carolina State University engineered a thin hybrid perovskite film with thermal conductivity of about 0.04 W/m·K at room temperature — five times better insulation than silicone. The material is 700–10,000 times stiffer than silicone and can be printed at large scales as a coating.

• Film's thermal conductivity is about 0.04 W/m·K versus 0.2 for silicone
• Material is 700–10,000 times stiffer than silicone
• Benzene rings in organic layers tune stiffness and heat transfer
• The film can be printed at large scales and applied as a coating