chiprook
← Hardware
HardwareOctober 2, 2026, 06:51

CSPs shift to multi-vendor co-design for custom ASICs

Hyperscale cloud providers are broadening their custom ASIC partner networks, moving away from single-supplier deals toward multi-vendor integration. According to Digitimes, this boosts MediaTek and Broadcom ASIC revenue tied to Google TPUs, while TSMC's 3nm, 2nm and CoWoS capacity stays tight.

CSPs shift to multi-vendor co-design for custom ASICs
#Google#MediaTek#Broadcom#TSMC
Read next
Hardware

Interview: Advanced packaging shifts toward system-level co-design for AI

Hardware

ASIC shipments to top GPUs in 2027 as ABF substrate bottlenecks shift

Hardware

MediaTek TPU orders rise as chip capacity war intensifies

Hardware

AI boom keeps PCB supply chain tight through 2027