CSPs shift to multi-vendor co-design for custom ASICs
Hyperscale cloud providers are broadening their custom ASIC partner networks, moving away from single-supplier deals toward multi-vendor integration. According to Digitimes, this boosts MediaTek and Broadcom ASIC revenue tied to Google TPUs, while TSMC's 3nm, 2nm and CoWoS capacity stays tight.
- CSPs are adding ASIC partners instead of relying on one supplier
- Google TPU investment reportedly pays back within one year
- MediaTek and Broadcom see rising ASIC revenue
- TSMC 3nm, 2nm and CoWoS capacity remains tight
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